Micron Technology to invest $24B in Singapore to boost wafer output

By Mucahithan Avcioglu

ISTANBUL (AA) — US chipmaker Micron Technology said Tuesday it will invest about $24 billion to expand its wafer manufacturing operations in Singapore, as the company moves to increase production capacity amid global semiconductor shortages.

“This new facility represents a planned investment of approximately US $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space,” Micron said in a statement.

The company said wafer output from the new facility is scheduled to begin in the second half of calendar 2028, supporting growing demand for NAND technology driven by the rapid expansion of artificial intelligence (AI) and data-centric applications.

The rapid growth of AI and data-focused technologies has pushed demand for NAND memory higher in recent months.

Micron operates manufacturing facilities in Singapore as part of its broader Asia production network, which also includes sites in China, Taiwan, Japan and Malaysia.

The company is also building a $7 billion advanced packaging facility in Singapore to produce high-bandwidth memory (HBM), a type of dynamic random-access memory, or DRAM — used in AI applications.

According to Micron, the high-bandwidth memory facility, located within the same manufacturing complex, is expected to make a significant contribution to its HBM supply by 2027.

“As HBM becomes a part of Micron’s Singapore manufacturing footprint, the company expects opportunities for synergies between NAND and DRAM production,” Micron said.

The company added that capacity growth at the new plant will be managed in line with market demand.

The NAND expansion is expected to create more than 1,600 jobs in fab engineering and operations, including roles linked to AI, robotics and smart manufacturing. The HBM facility previously created about 1,400 new positions.